1 motorola sensor device data $"$ "##%" # "
# %$ "##%" # " ! $ !"$%" ! #$ "$ the motorola MPX4250A/mpxa4250a series manifold absolute pressure (map) sensor for engine control is designed to sense absolute air pressure within the intake manifold. this measurement can be used to compute the amount of fuel required for each cylinder. the MPX4250A/mpxa4250a series piezoresistive transducer is a stateoftheart monolithic silicon pressure sensor designed for a wide range of applications, particularly those employing a microcontroller or microprocessor with a/d inputs. this transducer combines advanced micromachining techniques, thinfilm metallization and bipolar processing to provide an accurate, highlevel analog output signal that is proportional to the applied pressure. the small form factor and high reliability of onchip integration make the motorola sensor a logical and economical choice for the automotive system engineer. features ? 1.5% maximum error over 0 to 85 c ? specifically designed for intake manifold absolute pressure sensing in engine control systems ? patented silicon shear stress strain gauge ? temperature compensated over 40 to +125 c ? offers reduction in weight and volume compared to existing hybrid modules ? durable epoxy unibody element or thermoplastic small outline, surface mount package ? ideal for nonautomotive applications application examples ? turbo boost engine control ? ideally suited for microprocessor or microcontroller based systems pins 4, 5, and 6 are no connects for unibody device pins 1, 5, 6, 7, and 8 are no connects for small outline package device figure 1. fully integrated pressure sensor schematic v s sensing element v out gnd thin film temperature compensation and gain stage #1 gain stage #2 and ground reference shift circuitry order this document by MPX4250A/d
semiconductor technical data ? motorola, inc. 2000 pin number note: pins 1, 5, 6, and 7 are internal device connections. do not connect to external circuitry or ground. pin 1 is noted by the notch in the lead. 1 2 3 n/c v s gnd 5 6 7 n/c n/c n/c port option case 482 port option case 482a 4v out 8 n/c small outline package
integrated pressure sensor 20 to 250 kpa (2.9 to 36.3 psi) 0.2 to 4.9 v output pin number note: pins 4, 5, and 6 are internal device connections. do not connect to external circuitry or ground. pin 1 is noted by the notch in the lead. basic chip carrier element case 867, style 1 port option case 867b, style 1 1 2 3 v out gnd v s 4 5 6 n/c n/c n/c unibody package rev 4
2 motorola sensor device data maximum ratings (1) parametrics symbol value unit maximum pressure (2) (p1 > p2) p max 1000 kpa storage temperature t stg 40 to +125 c operating temperature t a 40 to +125 c notes: 1. t c = 25 c unless otherwise noted. 2. exposure beyond the specified limits may cause permanent damage or degradation to the device. operating characteristics (v s = 5.1 vdc, t a = 25 c unless otherwise noted, p1 > p2, decoupling circuit shown in figure 3 required to meet electrical specifications.) characteristic symbol min typ max unit pressure range (1) p op 20 e 250 kpa supply voltage (2) v s 4.85 5.1 5.35 vdc supply current i o e 7.0 10 madc minimum pressure offset (3) (0 to 85 c) @ v s = 5.1 volts v off 0.133 0.204 0.274 vdc full scale output (4) (0 to 85 c) @ v s = 5.1 volts v fso 4.826 4.896 4.966 vdc full scale span (5) (0 to 85 c) @ v s = 5.1 volts v fss e 4.692 e vdc accuracy (6) (0 to 85 c) e e e 1.5 %v fss sensitivity d v/ d p e 20 e mv/kpa response time (7) t r e 1.0 e msec output source current at full scale output l o + e 0.1 e madc warmup time (8) e e 20 e msec offset stability (9) e e 0.5 e %v fss notes: 1. 1.0 kpa (kilopascal) equals 0.145 psi. 2. device is ratiometric within this specified excitation range. 3. offset (v off ) is defined as the output voltage at the minimum rated pressure. 4. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. 5. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. accuracy (error budget) consists of the following: ? linearity: output deviation from a straight line relationship with pressure over the specified pressure range. ? temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 c. ? tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 c, relative to 25 c. ? variation from nominal: the variation from nominal values, for offset or full scale span, as a percent of v fss , at 25 c. 7. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. 8. warmup is defined as the time required for the product to meet the specified output voltage after the pressure has been stab ilized. 9. offset stability is the product's output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test. mechanical characteristics characteristics typ unit weight, basic element (case 867) 4.0 grams weight, small outline package (case 482) 1.5 grams
3 motorola sensor device data figure 2. crosssectional diagram (not to scale) fluorosilicone die coat wire bond stainless steel metal cover rtv die bond die p1 p2 epoxy case lead frame sealed vacuum reference 1.0 f ips 470 pf output vs 5 v 0.01 f gnd vout figure 3. recommended power supply decoupling and output filtering. for additional output filtering, please refer to application note an1646. figure 2 illustrates the absolute pressure sensing chip in the basic chip carrier (case 867). a fluorosilicone gel iso- lates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. the mpx4250 a/mpxa4250a series pressure sensor op- erating characteristics and internal reliability and qualifica- tion tests are based on use of dry air as the pressure media. media, other than dry air, may have adverse ef- fects on sensor performance and longterm reliability. contact the factory for information regarding media com- patibility in your application. figure 3 shows the recommended decoupling circuit for in- terfacing the output of the integrated sensor to the a/d input of a microprocessor or microcontroller. figure 4 shows the sensor output signal relative to pres- sure input. typical, minimum, and maximum output curves are shown for operation over temperature range of 0 to 85 c using the decoupling circuit shown in figure 3. the output will saturate outside of the specified pressure range. 0 output (volts) 5.0 4.5 4.0 3.5 3.0 pressure (ref: to sealed vacuum) in kpa max min 0 10 20 30 40 50 60 70 80 90 100 120 130 140 150 160 170 180 190 200 210 220 230 2.5 2.0 1.5 1.0 0.5 240 250 260 110 typ transfer function: v out = v s * (0.004 x p0.04) error v s = 5.1 vdc temp = 0 to 85 c figure 4. output versus absolute pressure
4 motorola sensor device data transfer function nominal transfer value: v out = v s (p x 0.004 0.04) nominal transfer value: +/ (pressure error x temp. factor x 0.004 x v s ) nominal transfer value: v s = 5.1 v 0.25 vdc temperature error band temp multiplier 40 3 0 to 85 1 +125 3 temperature in c 4.0 3.0 2.0 0.0 1.0 40 20 0 20 40 60 140 120 100 80 temperature error factor pressure error band pressure error (max) 20 to 250 kpa 3.45 (kpa) note: the temperature multiplier is a linear response from 0 to 40 c and from 85 to 125 c. pressure (kpa) 75 100 125 150 175 200 225 25 50 250 4.0 3.0 2.0 1.0 0 1.0 2.0 3.0 4.0 5.0 5.0 0 pressure error (kpa)
5 motorola sensor device data ordering information unibody package (case 867) the MPX4250A series pressure sensors are available in the basic element package or with pressure port fittings that provide mounting ease and barbed hose connections. device type/order no. options case no. marking MPX4250A basic element 867 MPX4250A MPX4250Ap ported element 867b MPX4250Ap ordering information small outline package (case 482) the mpxa4250a series pressure sensors are available in the basic element package or with a pressure port fitting. two packing options are offered for each type. device type/order no. case no. packing options device marking mpxa4250a6u 482 rails mpxa4250a mpxa4250a6t1 482 tape and reel mpxa4250a mpxa4250ac6u 482a rails mpxa4250a mpxa4250ac6t1 482a tape and reel mpxa4250a information for using the small outline package (case 482) minimum recommended footprint for surface mounted applications surface mount board layout is a critical portion of the total design. the footprint for the surface mount packages must be the correct size to ensure proper solder connection inter- face between the board and the package. with the correct fottprint, the packages will self align when subjected to a solder reflow process. it is always recommended to design boards with a solder mask layer to avoid bridging and short- ing between solder pads. 0.660 16.76 0.060 typ 8x 1.52 0.100 typ 8x 2.54 0.100 typ 8x 2.54 0.300 7.62 figure 5. sop footprint (case 482) inch mm scale 2:1
6 motorola sensor device data package dimensions unibody, basic element (a) case 867 issue n style 1: pin 1. vout 2. ground 3. vcc 4. v1 5. v2 6. vex pin 1 f g n l r c b m j s notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a is inclusive of the mold stop ring. mold stop ring not to exceed 16.00 (0.630). a 123456 6 pl d seating plane t m a m 0.136 (0.005) t dim min max min max millimeters inches a 0.595 0.630 15.11 16.00 b 0.514 0.534 13.06 13.56 c 0.200 0.220 5.08 5.59 d 0.027 0.033 0.68 0.84 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc j 0.014 0.016 0.36 0.40 l 0.695 0.725 17.65 18.42 m 30 nom 30 nom n 0.475 0.495 12.07 12.57 r 0.430 0.450 10.92 11.43 s 0.090 0.105 2.29 2.66 positive pressure (p1) unibody, pressure side ported (ap) case 867b issue e style 1: pin 1. v out 2. ground 3. v cc 4. v1 5. v2 6. v ex seating plane r n c j pin 1 m q m 0.25 t b 6x d g f s k v s p m 0.173 q s t l u a 1 2 34 5 6 notes: 1. dimensions are in millimeters. 2. dimensions and tolerances per asme y14.5m, 1994. dim min max millimeters a 29.08 29.85 b 17.4 18.16 c 7.75 8.26 d 0.68 0.84 f 1.22 1.63 g 2.54 bsc j 0.36 0.41 k 17.65 18.42 l 7.37 7.62 n 10.67 11.18 p 3.89 4.04 q 3.89 4.04 r 5.84 6.35 s 5.59 6.1 u 23.11 bsc v 4.62 4.93 t p p q q
7 motorola sensor device data package dimensions continued small outline package, basic element small outline package, pressure side ported case 482a issue a case 482 issue o dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 12.70 0.520 0.500 13.21 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0 7 0 7 n 0.444 0.448 11.28 11.38 s 0.709 0.725 18.01 18.41 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5 typical draft. s d g 8 pl 4 5 8 1 s b m 0.25 (0.010) a s t a b c m j k pin 1 identifier h seating plane t n v w v 0.245 0.255 6.22 6.48 w 0.115 0.125 2.92 3.17 dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 5.38 0.230 0.212 5.84 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0 7 0 7 n 0.405 0.415 10.29 10.54 s 0.709 0.725 18.01 18.41 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5 typical draft. s d g 8 pl 4 5 8 1 n s b m 0.25 (0.010) a s t a b c m j k pin 1 identifier h seating plane t
8 motorola sensor device data motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty, represe ntation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation co nsequential or incidental damages. atypicalo parameters which may be provided in motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. motorola does not convey any license under its patent rights nor the rights of others. motor ola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other ap plications intended to support or sustain life, or for any other application in which the failure of the motorola product could create a s ituation where personal injury or death may occur. should buyer purchase or use motorola products for any such unintended or unauthorized app lication, buyer shall indemnify and hold motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless agains t all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or dea th associated with such unintended or unauthorized use, even if such claim alleges that motorola was negligent regarding the design or manufa cture of the part. motorola and are registered trademarks of motorola, inc. motorola, inc. is an equal opportunity/affirmative action employer. how to reach us: usa / europe / locations not listed : motorola literature distribution; japan : motorola japan ltd.; sps, technical information center, 3201, p.o. box 5405, denver, colorado 80217. 13036752140 or 18004412447 minamiaz abu. minatoku, tokyo 1068573 japan. 8 1334403569 technical information center: 18005216274 asia / pacific : motorola semiconductors h.k. ltd.; silicon harbour centre, 2, dai king street, tai po industrial estate, tai po, n.t., hong kong. 85226668334 home page : http://www.motorola.com/semiconductors/ MPX4250A/d ?
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